We connect chips.
You create the impossible.

We inspire the world to
rethink computing

Our technology integrates high-speed graphene photonics directly onto any electronic chip, inspiring innovators to rethink compute architectures.

Welcome to our new headquarters, FabONE

We secured € 254.4 million in funding

Turning challenges into opportunities

Compute demand is accelerating. Connectivity is falling behind.

*per lane, Alphawave UCIe 2.0

Chip communication is inefficient

Standard electric connections are the bottleneck. They are too slow, generate too much heat, waste energy, throttle bandwidth, and only work over very short distances. These physical limitations drive costs up and hold the industry back.

The world needs a new way to connect chips,
and we’re making it.

Photonics + Electronics on One Wafer

Harnessing the optical properties of graphene, we enable chips to compute with electricity and communicate with photons. This technology removes existing bandwidth limitations, allowing data centers to operate faster, cooler, and with far less energy.

Faster, More Efficient Data Transfer

Our chips convert electrical signals to optical signals instantly, reducing latency, cutting delays, and saving energy while increasing bandwidth.

Longer-Distance, High-Speed Connectivity

Optical waveguides replace copper, enabling fast, low-loss data transform.

Seamless Manufacturing Integration

CMOS-compatible processing fits into any existing chip production.

Graphene: A Single Layer That Transforms Connectivity

Graphene enables a more compact, low-power, and high-speed approach to integrating photonics and electronics at the chip level.

New Efficiency

Allows high-speed and high-efficiency broadband modulators and detectors, driving the next generation of integrated photonics.

Integration

The only material with the temperature budget, devices, and compatibility to allow BEOL integration.

Fit for Mass-Production

Works with standard CMOS fabs, ensuring scalability.

We’re moving fast!

Incorporation

Officially established by Daniel and Sebastian Schall

Investment

Raised €11.2M in VC, including public funding. Investment co-led by Vsquared and Cambium.

Development

Started to build a wafer fabrication technology.

Investment

€228.7M Grant Secured (IPCEI)

€25.7M Private Investment Secured

Build

Moved into FabOne Facility (15,000m² Fabrication space; 2,000m² office space)

Fab construction begins on a scalable pilot line for 300mm wafer technology.

Innovation insights

What is a big enough challenge for an industry professional who wants to make an impact?

Dr. Cedric Huyghebaert shares insights on mentoring engineers, societal mechanisms, and the challenges of integrating new technology into semiconductors.

Our € 254,4 mio financing round.

Our new headquarters, FabONE

A change conversation

Participating in the third EU Clean Transition Dialogue.