The smartest way to bridge electronic and photonic worlds is making use of one layer of carbon atoms as a translator between both.
Chip connectivity redefined
New material, new possibilities.
One layer of carbon atoms makes the difference: The key to enabling co-integration of electronics and optics is graphene, a material that is just one atom thin and known for its superior optical, electrical, and thermal properties. Graphene outperforms any other material system, opening the door to products that were inaccessible up to now.
Backed up by a strong patent portfolio, we bring graphene into full compliance with existing high-volume manufacturing.
We connect chips.
The need for high-throughput and low-latency data transfer has never been greater. Traditional electronic connections have been the backbone of computing systems as we know them.
However, they are reaching their physical limitations as electronic communication between chips is restricted to a few centimeters. Future semiconductor technology requires an advanced solution.
Our solution is a combination of computing with electrons and communication with photons. We co-integrate optics (CIO) with electronics for massive parallel optical chip connectivity up to kilometers in distance. CIO is brought to life through graphene as translator for unmatched chip-to-chip communication.
We switch electrons to photons and vice versa.
Our innovation is the seamless integration of optical systems for latest chip designs and fabrication technologies. Electrons are best for computing within a chip. Photons are best for communication between chips, as light is the best-known information carrier over longer distance.
Our technology allows us to use the best of both: computing with electrons and communication with photons. Our co-integrated optics (CIO) system is based on graphene as translator to convert electronic signals into optical signals and vice versa.
Bridging the energy gap with efficiency.
As technology advances, the requirements for more powerful chips with higher bandwidth and lower power consumption are on the rise. However, the global energy production’s maximum capacity will soon be exhausted, failing to meet technological needs in data communication.
Data centers, already consuming 2% of global energy, play a pivotal role in meeting rising energy demands. Optimizing data center efficiency is essential for sustainable growth and technological advancements. In modern computing, the rise in technological applications that rely on data communication, such as generative or embedded AI, underlines the escalating energy requirements. The efficiency of data centers is directly related to further development of chip-based applications.
Potential business cases
Redefining industry frontiers.
Paving the future of generative AI.
In the deep-tech landscape, our contributions serve as the foundation for widespread innovation. Through more efficient and faster data communication at the chip level, it is possible to design efficient chip networks in data centers. As an application, generative AI systems, such as large language models can be further developed and trained, without straining global energy resources.
Driving smarter:
The impact of embedded AI.
AI inference is the essential component of artificial intelligence. Without inference, a machine’s ability to learn remains untapped. Our high-performance chip connections unlock this potential, transforming learning into a seamless process. In addition of applying our chip technologies to training and computations in data centers (Example 1, centralized AI), data communication can be utilized in embedded AI applications, such as in central control units in autonomous driving vehicles, to achieve technological leaps. Accelerating the communication between sensors and the control unit is the fundamental building block for the next level of autonomous driving.